SMT :surface mount technology 表面贴装技术

封装﹕ Package

贴片﹕ Pick and Place

拆焊﹕ Desoldering

再流﹕Reflow

浸焊﹕ Dip Soldering

拖焊﹕ Drag soldering

印制电路﹕Printed Circuit

印制线路﹕ Printed Wiring

印制电路板﹕ printed circuit board

印制线路板﹕printed wiring board

层压板﹕laminate

覆铜铜薄层压板﹕copper-clad laminate

基材﹕base material

成品板﹕production board

印刷﹕printing

导电图形﹕conductive pattern

印制元件﹕printed component

单面印制板﹕single-sided printed board

双面印制板﹕double-sided printed board

多层印制板﹕multilayer printed board

电烙铁﹕ Iron

热风嘴﹕ hot air reflowing noozle

吸锡带﹕soldering wick

吸锡器﹕tin extractor

焊后检验﹕post-soldering inspection

目视检验﹕visual inspection

机器检验﹕ machine inspection

焊点质量﹕ soldering joint quality

焊电缺陷﹕ soldering jont defect

错焊﹕ solder wrong

漏焊﹕ solder skips

虚焊﹕ pseudo soldering

冷焊﹕ cold soldering

桥焊﹕ solder bridge

脱焊﹕ open soldering